Capabilities and Technical

General

• Producibility Guidelines – Standard & Reduced Producibility parameters for circuit board design
• Technology Roadmap– a high level summary of current and future PWB manufacturing capabilities
• IPC 1710 – Completed industry standard survey of company capabilities, equipment, officers, and quality systems
   

Product Information

• Adhesiveless constructions are strongly recommended for all rigid-flex design Thin core constructions Z-axis thickness of rigid or flex/rigid-flex PWB’s can be minimized using 1 and 2 mil core laminates
• Flexible Silver Ink is an alternate material to achieve EMI/RFI shielding on flex circuits while maintaining high flexibility
• Bookbinder technology can be employed to achieve a tight bend radius with multiple flex layers
• Constantan is a nickel-copper alloy with properties that make it useful as a replacement for copper when heat load or thermal management are concerns

Materials Data

• ‘Reverse Engineering’ Available for flexible laminates, coversheets/bond films and rigid laminates
• Dupont Pyralux AP Adhesiveless flexible laminates - IPC-4204/11
• Dupont Pyralux LF flexible laminate, coversheets, bondplys - IPC-4204/1
• Arlon 85N rigid polyimide laminate
• Arlon 45N rigid high temperature (Tg) epoxy laminate

Test (In-House) Data

• Group "A" Testing per Military Specifications
• Group "B" Testing per IPC-TM650
• Group "C" Testing per IPC-TM650
• Approved Lab Suitability